JPH08779Y2 - 多層プリント板 - Google Patents
多層プリント板Info
- Publication number
- JPH08779Y2 JPH08779Y2 JP1990086209U JP8620990U JPH08779Y2 JP H08779 Y2 JPH08779 Y2 JP H08779Y2 JP 1990086209 U JP1990086209 U JP 1990086209U JP 8620990 U JP8620990 U JP 8620990U JP H08779 Y2 JPH08779 Y2 JP H08779Y2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- pattern
- printed board
- multilayer printed
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000005476 soldering Methods 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 230000007257 malfunction Effects 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990086209U JPH08779Y2 (ja) | 1990-08-16 | 1990-08-16 | 多層プリント板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990086209U JPH08779Y2 (ja) | 1990-08-16 | 1990-08-16 | 多層プリント板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0444177U JPH0444177U (en]) | 1992-04-15 |
| JPH08779Y2 true JPH08779Y2 (ja) | 1996-01-10 |
Family
ID=31817758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990086209U Expired - Fee Related JPH08779Y2 (ja) | 1990-08-16 | 1990-08-16 | 多層プリント板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08779Y2 (en]) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5429055A (en) * | 1977-08-09 | 1979-03-03 | Shindo Denshi Kougiyou Kk | Method of making print wiring substrate |
| JPS56148840A (en) * | 1980-04-22 | 1981-11-18 | Citizen Watch Co Ltd | Mounting structure for ic |
| JPS61182096U (en]) * | 1985-05-07 | 1986-11-13 | ||
| JPS62184774U (en]) * | 1986-05-15 | 1987-11-24 | ||
| JPS6379064U (en]) * | 1986-11-11 | 1988-05-25 | ||
| JPS6437079U (en]) * | 1987-08-31 | 1989-03-06 | ||
| JPH0216035A (ja) * | 1988-07-05 | 1990-01-19 | Kubota Ltd | 不等直径穴付ｆｒｐ成形品の製造法 |
-
1990
- 1990-08-16 JP JP1990086209U patent/JPH08779Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0444177U (en]) | 1992-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |